Suction - a device for removing solder . It is a vacuum pump with a tip for drawing in molten solder from the treated surface. Usually used for dismantling electronic components.
The simplest and most common designs are based on a vacuum pump in the form of a spring-loaded piston with a lock of its position in the cocked position, with the tip of the inlet channel in the form of a constriction. As a rule, the tip is replaceable and made of PTFE . A pin is added to the piston, which clears the tip channel from the solder when the piston is cocked. Principle of action: the solder is melted at the soldering point, a cocked suction is brought in, the release button is pressed, the spring pushes the piston, the pressure drop sucks the solder inward, freeing the parts on the board from the solder.
In professional designs, the suction is supplied with a specialized automated vacuum pump and a temperature-controlled tip for simultaneous melting and suction of solder.
When dismantling parts using suction, attention should be paid to the size of the tracks that fit the part to be dismantled. When working with thin tracks, the use of suction can lead to their detachment from the board. In such cases, instead of a suction, it is better to use a copper sheath of coaxial cable.