Microminiaturization

Weight and Dimension Reduction

Cost Reduction

Improving Reliability

Reliability of electronic equipment in the broad sense refers to its ability to fail-free to perform specified functions within the required period of time. The main cause of failures is the failure of individual elements, so the average failure rate of the electronic device as a whole is determined by the reliability of all its constituent elements. The reliability of electronic equipment, in particular, can be improved by automating the production and use of microminiature electro-radio elements, such as integrated circuits and functional electronic devices. These measures can significantly reduce the number of soldered joints , which in certain cases are the cause of failures. In addition, the use of functional devices almost completely eliminates failures caused by various coefficients of linear expansion of the structural components, since they are often performed on the basis of a homogeneous material. Due to the reduced dimensions of electronic equipment, it is also possible to perform continuous sealing , which enhances protection against environmental influences and increases the mechanical strength of the structure.

Power Reduction

Performance Improvement

Design Simplification

Feature

Packaging Density

One of the main indicators characterizing the degree of miniaturization of electronic equipment is the packing density, which shows the number of elements of an electrical circuit or circuit ( electrical resistances , capacities , inductances , etc.) enclosed in a unit volume of an electronic device. The packing density largely depends on the used elemental base , rationality of the layout, structural losses due to installation, load-bearing structures, heat-dissipating and other protection elements. So, for example, the packing density of electronic equipment based on electron tubes reaches 0.3 el / cm ³ , based on modular designs and discrete semiconductor elements - 2.5 el / cm ³ , and on the basis of micromodules - more than 10 el / cm ³ . An even greater degree of miniaturization can be achieved through the use of integrated electronics products, while the density increases up to several thousand elements in 1 cm ³ . It is worth noting that this indicator can be used to evaluate not only final electronic devices, but individual integrated circuits. In this case, the packing density shows the number of elements (most often transistors ) per unit area of ​​the semiconductor crystal.

Standardization of forms and sizes

Printed Editing

Pin mounting

Surface Mount

The use of modular designs and discrete elements

Micromodular Design

The micromodular method of designing electronic equipment was widely used in the second half of the 1950s and during the 1960s. Micromodules are miniature functionally complete units that cannot be repaired and in case of a malfunction are replaced as a whole. In accordance with its electrical circuit, each micromodule performs a specific function - an amplifier , generator , trigger , etc. Micromodules are assembled from separate parts (microelements), combined into a common design of standard shape and size, ensuring their sealing and protection from external influences. The industry produced flat, bookcase, cylindrical, tablet and other types of micromodules. The most widespread at the time were bookcase and flat micromodules ^{[6] [7] [3] [8]} .

Flat micromodules are single-sided or double-sided printed circuit boards with miniature elements mounted by soldering or gluing with electrically conductive glue, protected from external influences by a metal cap and epoxy compound . Flat micromodules have a fixed width, and their length and height can vary depending on the number and design features of the elements included in them ^[9] .

The shelf micromodule differs from the flat one in that for the placement of microelements, a “whatnot” design is used, in which the horizontal shelves are microboards and the vertical ones are the connecting conductors (jumpers). Circuit elements of the rack-mounted micromodule can be printed or mounted. Usually, one element is installed on one side of the microplate, leaving the other side free. After assembly and soldering, the micromodule is also sealed with a compound ^{[10] [11]} .

Integrated Electronics

Film Integrated Circuits

Hybrid Integrated Circuits

Semiconductor Integrated Circuits

Functional Electronics

Acoustoelectronics

Magnetoelectronics

Optoelectronics

Dielectric Electronics

Molecular Electronics

The use of nanoelectronic devices

Heat Dissipation

When an electric current flows through an electronic device (such as a transistor ), thermal energy is released. If this heat is not removed to the environment, then the temperature of the device begins to rise. As a result of the reduction in the size of the elemental base, due to the microminiaturization process, the surface area through which heat can be removed from the electronic device is reduced. In addition, the density of the layout of the equipment increases, that is, the number of elements placed in the unit volume of the device increases. Since the heat dissipation of the elements in this case remains almost unchanged, this leads first to a deterioration in natural convection and radiant cooling, and then to an excess of the permissible operating temperature and, accordingly, device failure. Thus, further miniaturization becomes impossible without the introduction of additional measures to ensure the required temperature regime. The problem of heat removal is solved by reducing the dissipation capacity, introducing additional means of heat removal ( radiators , heat pipes , Peltier elements , etc.), enclosing individual parts in plastic for heat removal through heat conduction , as well as developing new elements and materials that can function under the influence higher temperatures ^{[12] [13]} .

Tyranny of Interconnections

Macro Level

Microlevel

Manufacturing Precision

Physical limits of microminiaturization

• Reliability
• Moore's Law

• Azarh S. Kh. , Fried E.A. Microminiaturization of electronic equipment. - M. — L .: Gosenergoizdat, 1963. - 80 p. - 47,000 copies.
• Aleksenko A. G. , Badulin S. S. , Barulin L. G. et al. Fundamentals of the design of microelectronic equipment / ed. B.F. Vysotsky. - M .: Soviet Radio, 1978.- 352 p. - (Design of electronic equipment on integrated circuits).
• Basic lectures on electronics / Sat. under the general. ed. V. M. Proleiko . - Moscow: Technosphere, 2009. - T. Volume II. Solid state electronics. - 608 p. - 1,500 copies - ISBN 978-5-94836-215-1 .
• Belevtsev A.T. Technology for the production of radio equipment. - Ed. 2nd, revised and supplemented. - M .: Energy, 1971. - 544 p.
• Efimov I.E. , Kozyr I. Ya. Fundamentals of microelectronics. - 3rd ed. - SPb. : Doe, 2008 .-- 384 p. - 2000 copies. - ISBN 978-5-81140-866-5 .
• Kalish I. Kh. Microminiature Electronics = Microminiature Electronics / Per. from English V.S. Pershenkova . - M .: Energy, 1975 .-- P. 216.
• Sorin Ya. M. Reliability of electronic equipment. - M. — L .: Gosenergoizdat, 1961. - 72 p. - 46,000 copies.
• Ushakov N. N. Technology of elements of computers. - Ed. 2, rev. and add. - M .: Higher school, 1976. - 413 p. - 30,000 copies.